Product Data Sheet
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SikaFast®-3511

Fast curing, toughened, high strength, structural adhesive

SikaFast®-3511  is a  fast  curing time,  1:1 ratio, 2-component adhesive based on methyl methacrylate (MMA) polymer technology. Uncured SikaFast®-3511 is a thixotropic, non-sagging paste which allows an easy and precise application.  

  • Strength development within minutes after application
  • Non-sagging and thixotropic formulation
  • Adhesion to a wide range of substrates without or with limited surface preparation
  • Very good strength and impact / peel resistance
 
Product Data Sheet
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PRODUCT BENEFITS

  • Strength development within minutes after application
  • Non-sagging and thixotropic formulation
  • Adhesion to a wide range of substrates without or with limited surface preparation
  • Very good strength and impact / peel resistance
 

Usage

SikaFast®-3511 is a fast curing, flexibilized structural adhesive designed to substitute welding, riveting and other mechanical fastening. SikaFast®-3511 is suitable for high strength fastening of joints on different types of substrates including top coats, metals, and plastics with no or limited surface preparation.  This product is suitable for experienced professional users only. Tests with actual substrates and conditions have to be performed ensuring adhesion and material compatibility.  

Packaging

Dual cartridge

400 ml

Mixer: Sulzer MFQ 10-24T

Product Details

Typical Product Data
Properties

SikaFast®-3511 (A)

SikaFast®-3511 (B)

Chemical base

Methacrylate

Color (CQP001-1)

 

mixed

Off-White

Tan

Light Yellow

Cure mechanism

Radical polymerization

Density (uncured)

 

mixed (calculated)

0.97 kg/l (8.1 lb/gal)

0.97 kg/l (8.1 lb/gal)

0.97 kg/l (8.1 lb/gal)

Mixing ratio

by volume

by weight

1 : 1

1 : 1

Consistency

Thixotropic paste

Application temperature

10 ─ 35 °C (50 ─ 95 °F)

Open time (CQP526-2)

4 minutes A

Peak exotherm time / temperature

12 minutes / 110 °C (230 °F) A

Shore D hardness (CQP023-1 / ISO 48-4)

75

Tensile strength (ASTM D638)

16 MPa (2300 psi)

E-Modulus (ASTM D638)

elongation 0.1 ─ 1.0 %

780 MPa (110 ksi)

Tensile lap-shear strength (CQP046-6 / ISO 4587)

21 MPa (3050 psi)

Service temperature (CQP513-1)

-40 ─ 80 °C (-40 ─ 176 °F)

Shelf life

9 months B

CQP = Corporate Quality Procedure

A) 23 °C (73 °F) / 50 % r. h.

B) stored at temperature below 25 °C (77 °F) protect from direct sun light
Technical Information

CURE MECHANISM

SikaFast®-3511 cures according to radical chain polymerization.
For an ideal curing process, it is required to homogeneously mix both components with the defined ratio. Open and cure time are influenced by mixing ratio deviations as well as temperature. The higher the temperature the shorter the open and cure time and vice versa.
Despite the quick strength build-up, exposure to premature stresses must be avoided since this may result in a reduction of mechanical properties and loss of adhesion.

CHEMICAL RESISTANCE

In the view of potential chemical or thermal exposure, it is required to conduct project related testing.

Application

Application Information

Surface Preparation

Surfaces must be clean, dry and free from grease, oil and dust. Remove all loose particles or residues by cleaning it thoroughly.
Due to the diversity of materials, preliminary tests with original substrates are necessary.

Application

SikaFast®-3511 is applied with a mixing ratio of 1:1 by volume from cartridges. If applied in large masses, heat is generated by the exothermic reaction. To avoid excessive temperature increase, bond thickness is limited to 5 mm (0.2 in), but must measure at least 0.5 mm (0.02 in).

Optimum temperature for the bonding process is between 15 °C and 25 °C (59 °F and 77 °F). The approved temperature range for substrates and adhesive is between 10 °C and 35 °C (50 °F and 95 °F). The influence of the reactivity by temperature changes must be respected.
The parts must always be joined within the open time.
SikaFast®-3511 shall be processed with pneumatic or electric driven piston guns.

 

Removal

Uncured excess of SikaFast®-3511 can be removed easily before curing with a dry wipe, with Sika® Remover-208 or another suitable solvent. Once the adhesive is cured it can only be removed mechanically.
Hands and exposed skin have to be washed immediately using a suitable industrial hand cleaner and water.
Do not use solvents on skin.

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