SikaFast®-3511

SikaFast®-3511 cures according to radical chain polymerization.
For an ideal curing process, it is required to homogeneously mix both components with the defined ratio. Open and cure time are influenced by mixing ratio deviations as well as temperature. The higher the temperature the shorter the open and cure time and vice versa.
Despite the quick strength build-up, exposure to premature stresses must be avoided since this may result in a reduction of mechanical properties and loss of adhesion.

In the view of potential chemical or thermal exposure, it is required to conduct project related testing.

Surfaces must be clean, dry and free from grease, oil and dust. Remove all loose particles or residues by cleaning it thoroughly.
Due to the diversity of materials, preliminary tests with original substrates are necessary.

SikaFast®-3511 is applied with a mixing ratio of 1:1 by volume from cartridges. If applied in large masses, heat is generated by the exothermic reaction. To avoid excessive temperature increase, bond thickness is limited to 5 mm (0.2 in), but must measure at least 0.5 mm (0.02 in).

Optimum temperature for the bonding process is between 15 °C and 25 °C (59 °F and 77 °F). The approved temperature range for substrates and adhesive is between 10 °C and 35 °C (50 °F and 95 °F). The influence of the reactivity by temperature changes must be respected.
The parts must always be joined within the open time.
SikaFast®-3511 shall be processed with pneumatic or electric driven piston guns.

Uncured excess of SikaFast®-3511 can be removed easily before curing with a dry wipe, with Sika® Remover-208 or another suitable solvent. Once the adhesive is cured it can only be removed mechanically.
Hands and exposed skin have to be washed immediately using a suitable industrial hand cleaner and water.
Do not use solvents on skin.