
SikaFast®-3531
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SikaFast®-3531 is an extended open time, 1:1 ratio 2-component adhesive based on methyl methacrylate (MMA) polymer technology. Uncured SikaFast®-3531 is a thixotropic, non-sagging paste which allows an easy and precise application.
- Extended working time for larger applications
- Non-sagging and thixotropic formulation
- Adhesion to a wide range of substrates without or with limited surface preparation
- Very good strength and impact / peel resistance
PRODUCT BENEFITS
- Extended working time for larger applications
- Non-sagging and thixotropic formulation
- Adhesion to a wide range of substrates without or with limited surface preparation
- Very good strength and impact / peel resistance
Usage
SikaFast®-3531 is an extended open time, flexibilized structural adhesive designed to substitute welding, riveting and other mechanical fastening. SikaFast®-3531 is suitable for high strength fastening of joints on different types of substrates including top coats, metals, and plastics with no or limited surface preparation. This product is suitable for experienced professional users only. Tests with actual substrates and conditions have to be performed ensuring adhesion and material compatibility.Packaging
SikaFast®-3531
Dual cartridge | 400 ml |
Mixer: Nordson 7701385 |
SikaFast®-3531 (A)
Pail | 5 gal (US) |
SikaFast®-3531 (B)
Pail | 5 gal (US) |
Product Details
Properties |
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Chemical base | Methacrylate | ||||
Color (CQP001-1) |
mixed |
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Cure mechanism | Radical polymerization | ||||
Density (uncured) |
mixed (calculated) |
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Mixing ratio | by volume by weight | 1 : 1 1 : 1 | |||
Consistency | Thixotropic paste | ||||
Application temperature | 10 ─ 35 °C (50 ─ 95 °F) | ||||
Open time (CQP526-2) | 15 minutes A | ||||
Peak exotherm time / temperature | 30 minutes / 105 °C (221 °F) A | ||||
Shore D hardness (CQP023-1 / ISO 48-4) | 80 | ||||
Tensile strength (ASTM D638) | 16 MPa (2 300 psi) | ||||
E-Modulus (ASTM D638) | elongation 0.1 ─ 1.0 % | 780 MPa (110 ksi) | |||
Tensile lap-shear strength (CQP046-6 / ISO 4587) | 21 MPa (3 050 psi) | ||||
Service temperature (CQP513-1) | -40 ─ 80 °C (-40 ─ 176 °F) | ||||
Shelf life | 9 months B |
CQP = Corporate Quality Procedure | A) 23 °C (73 °F) / 50 % r. h. |
B) stored at temperature below 25 °C (77 °F) protect from direct sun light |
CURE MECHANISM
SikaFast®-3531 cures according to radical chain polymerization.
For an ideal curing process, it is required to homogeneously mix both components with the defined ratio. Open and cure time are influenced by mixing ratio deviations as well as temperature. The higher the temperature the shorter the open and cure time and vice versa.
Despite the quick strength build-up, exposure to premature stresses must be avoided since this may result in a reduction of mechanical properties and loss of adhesion.
CHEMICAL RESISTANCE
In the view of potential chemical or thermal exposure, it is required to conduct project related testing.
Application
Surface Preparation
Surfaces must be clean, dry and free from grease, oil and dust. Remove all loose particles or residues by cleaning it thoroughly.
Due to the diversity of materials, preliminary tests with original substrates are necessary.
Application
SikaFast®-3531 is applied with a mixing ratio of 1:1 by volume from cartridges or bulk packaging. If applied in large masses, heat is generated by the exothermic reaction. To avoid excessive temperature increase, bond thickness is limited to 5 mm (0.2 in), but must measure at least 0.5 mm (0.02 in).
Optimum temperature for the bonding process is between 15 °C and 25 °C (59 °F and 77 °F). The approved temperature range for substrates and adhesive is between 10 °C and 35 °C (50 °F and 95 °F). The influence of the reactivity by temperature changes must be respected.
The parts must always be joined within the open time.
SikaFast®-3531 shall be processed with pneumatic or electric driven piston guns as well as pump equipment.
For advice on selecting and setting up a suitable pump system, contact the System Engineering Department of Sika Industry.
Removal
Uncured excess of SikaFast®-3531 can be removed easily before curing with a dry wipe, with Sika® Remover-208 or another suitable solvent. Once the adhesive is cured it can only be removed mechanically.
Hands and exposed skin have to be washed immediately using a suitable industrial hand cleaner and water.
Do not use solvents on skin.