Sikadur®-23 Lo-Mod Gel

Low-modulus, paste-consistency, epoxy resin binder

Sikadur®-23 Lo-Mod Gel, is a 2-component, 100 % solids, moisture-tolerant, low-modulus, non-sag paste-consistency, epoxy resin binder. It conforms to the current ASTM C-881 and AASHTO M-235 specifications.

  • Non-sag consistency
  • Convenient easy to mix ratio A:B = 1:1 by volume
  • Moisture-tolerant epoxy adhesive binder