Sikadur®-23 Lo-Mod Gel
Low-modulus, paste-consistency, epoxy resin binder
Sikadur®-23 Lo-Mod Gel, is a 2-component, 100 % solids, moisture-tolerant, low-modulus, non-sag paste-consistency, epoxy resin binder. It conforms to the current ASTM C-881 and AASHTO M-235 specifications.
- Non-sag consistency
- Convenient easy to mix ratio A:B = 1:1 by volume
- Moisture-tolerant epoxy adhesive binder