SikaBond®-T100
All-in-One Hybrid urethane adhesive, moisture vapor and sound reduction membrane
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SikaBond®-T100 is a one component, zero VOC, permanently elastic, super strong, very low permeability, moisture-cure, all-in-one hybrid polyurethane adhesive that offers unlimited moisture protection, crack bridging and sound reduction for full surface wood floor bonding.
- 150% Elongation
- Bonds up to 3/4" solid and engineered wood
- Cleans off prefinished floors before and after cure
- Unlimited subfloor moisture vapor protection
- No moisture testing required - a dry to touch substrate is the only requirement
- ZERO VOC
- Contains no water, solvent or isocyanates
- Low moisture vapor permeability
- Sound protection - meets local IIC and STC requirements
- Crack Bridging
- Very easy to spread
- Low odor
- High elongation and permanently elastic - allows planks to expand and contract without damage to the adhesive
Usage
SikaBond®-T100 may be used for solid and engineered wood floors (strips, longstrips, planks, panels, boards), mosaic parquet, industrial parquet, wood paving (residential) as well as chip boards and plywood. Once cured, SikaBond®-T100 will generate a super strong bond to a variety of substrates for glue down installations and at the same time form a membrane which reduces moisture vapor transmission from the subfloor and sound reduction membrane.Advantages
- 150% Elongation
- Bonds up to 3/4" solid and engineered wood
- Cleans off prefinished floors before and after cure
- Unlimited subfloor moisture vapor protection
- No moisture testing required - a dry to touch substrate is the only requirement
- ZERO VOC
- Contains no water, solvent or isocyanates
- Low moisture vapor permeability
- Sound protection - meets local IIC and STC requirements
- Crack Bridging
- Very easy to spread
- Low odor
- High elongation and permanently elastic - allows planks to expand and contract without damage to the adhesive
Packaging
4 gal. (15.14 L)
Color
Off - white
Product Details
ENVIRONMENTAL INFORMATION
LEED® V4.1 CDPH Standard Method v1.2 | SCAQMD, Rule 1168 | BAAQMD, Reg. 8, Rule 51-226 (20 g/L limit) |
passes | passes | passes |
APPROVALS / STANDARDS
- Independently tested to - STC 62 (ASTM E-90) when used as a sound control membrane at the specified coverage.
- Independently tested to IIC = 67 (ASTM E-492) when used as a sound control membrane at the specified coverage.
- Carpet and Rug Institute (CRI) Green Label PLUS Certified
Chemical Base
Hybrid Polymer
Shelf Life
12 months from date of production if stored in undamaged original sealed containers
Storage Conditions
Keep in dry conditions and protected from direct sunlight at temperatures between 50 °F and 77 °F (10–25 °C)
Density
1.64 kg/L
Water Vapor Permeability is < 4 g/mmHg, 24h, m2 according to ASTM E-96 (< 4 Perms)
Texture
Easy to spread
Testing
45–50 | (7 days at 74 °F (24 °C) and 50 % R.H.) |
Tensile Strength
150 psi (1.03 MPa) | (7 days at 74 °F (24 °C) and 50 % R.H.) |
Shear Strength
2.0 N/mm², 1 mm adhesive thickness | (74 °F (24 °C) and 50 % R.H.) |
Service Temperature
-40–150 °F (-40–65 °C)
Application
Ambient Air Temperature
Room temperature between 50 °F (15 °C) and 90 °F (35 °C). For ambient temperatures standard construction guidelines should be followed. Follow all wood floor manufacturers’ acclimation and room temperature requirements.
Relative Air Humidity
Between 40 % and 70 % during installation is best for adhesive. See wood floor manufacturer for wood requirements.
Substrate Temperature
During laying and until SikaBond®-T100 has fully cured, substrate temperature should be greater than 60 °F (15 °C) and in the case of radiant floor heating, less than 70 °F (20 °C). For substrate temperatures, standard construction guidelines should be followed.
Substrate Moisture Content
For use as an adhesive only: SikaBond®-T100 is not affected by moisture or vapor transmission. For protection of the wood, follow the wood floor manufacturer’s requirements for subfloor moisture. If substrate is not acceptable per wood manufacturer’s requirements, use SikaBond®-T100 at recommended coverage rate for moisture protection or use Sika® MB.
For use as an adhesive and membrane: Concrete must be dry to touch. Inspect for any wetness at base of drywall or visible signs of moisture on concrete. Concrete and cement-based underlayments must be fully cured and free of any hydrostatic and/or moisture problems. When properly applied in accordance with Sika® guidelines, SikaBond®-T100 provides unlimited moisture vapor protection.
Curing Rate
Floor may accept light foot traffic after: 8 hours
Floor can be sanded after 18 hours.
Skin Time / Laying Time
45 min | 74 °F 50 % R.H. |
Coverage
- Coverage must be monitored to ensure accuracy of application. Trowel angle may prevent proper coverage.
- Applicator is responsible for periodic inspection of the trowel to check for excessive wear. Worn trowels must be replaced immediately.
- In case of uneven substrates, it may be necessary to use a notched trowel with bigger notches (avert hollow sections).
- Coverage must be monitored to ensure accuracy of application. Trowel angle may prevent proper coverage.
- Trowel size is recommended to obtain proper coverage larger sizes are acceptable. Excessive amounts of adhesive may cause wood flooring to slide while placing check coverage during installation.
- P5 trowels should be used at 90° angle, SC+MB trowel or 1/4 in. (6.3 mm) x 1/4 in. (6.3 mm) V-notch at 45° angle to subfloor to get stated coverages.
- Substrate Quality: Structurally sound, clean, dry, homogeneous, even, free from grease, dust and loose particles, paint, laitance, and other poorly adhering particles must be removed.
- The P5 and SC+MB trowel are available from Sika.
SUBSTRATE QUALITY
Substrate must be clean and dry, homogeneous, even, free from grease, dust and loose particles. Paint, laitance and other poorly adhering particles must be removed by mechanical means.
SUBSTRATE PREPARATION
- SikaBond®-T100 can be used on properly prepared, structurally sound concrete, cementitious patch/underlayments, chipboards, ceramic tiles, plywood.
- Concrete substrate must have a concrete surface profile of CSP 1-3.
- For on-grade subfloors Sika® recommends the use of Sika® MB, Sika® MB Redline, and Sika® MB EZ Rapid for best protection against sub-floor moisture – moisture testing is required by the wood flooring manufacturer for best results with the wood flooring products.
- Below grade applications are generally not recommended unless proper precautions are taken to protect the wood flooring from sub-floor and in-room humidity extremes.
- A 3,000 psi compressive strength is the minimum requirement needed for SikaBond wood floor installations, including glue-down wood floors, or glued/mechanically anchored subfloors. Sika products such as SikaLevel®-01 Primer Plus, Sika® MB, Sika® MB Redline, and Sika® MB EZ Rapid can be used on substrates as consolidators to satisfy the minimum psi compressive strength requirements.
- Preparation is a critical step in the installation process and will ensure a successful long term tenacious bond.
- All concrete, cement screed and gypsum based subfloors must be structurally sound, clean, dry, smooth; free of voids, projections, loose materials, oil, grease, sealers and other surface contaminants. Thoroughly clean with an industrial vacuum. Remove laitance or weak areas mechanically and thoroughly.
- For application over ceramic tiles it is necessary to grind tile surfaces and clean thoroughly with an industrial vacuum.
- For substrates with old well bonded non-water-soluble adhesive or adhesive residue use Sika® MB, Sika® MB Redline, or Sika® MB EZ Rapid – see appropriate product data sheet for installation instructions and proper details. If surface contains asphalt (cutback) adhesive, follow the Resilient Floor Covering Institute “Recommended Work Practices” for removal. When the asphalt (cutback) adhesive is sufficiently removed use the Sika® MB, Sika® MB Redline, or Sika® MB EZ Rapid to help promote adhesion to the subfloor or use a Sika® Level patch/level product in conjunction with the correct primer.
- SikaBond®-T100 will adhere to most common patching/ levelling compounds. Due to differences in asphalt-based adhesive types and performance capabilities, applicators must verify that preparation of the surface is sufficient prior to using Sika® MB or Sika® Level patch/ level compound. For unknown substrates, please contact Sika® Technical Services for best practices at 1-800-933-SIKA.