Sika® MB Redline

Solvent Free, Fast Epoxy Moisture Barrier

Sika® MB Redline is a 2-component, rapid curing, solvent free, low viscosity, epoxy moisture control system for use with all flooring systems that require protection from subfloor moisture.

  • Cures in 3 hours for fast turnaround jobs
  • Solvent-free (100% solids)
  • Easy roller applied application, low viscosity
  • Convenient, easy to mix packaging
  • Shorter construction periods
  • Excellent penetration and stabilization of the substrate
  • Reduction of adhesive consumption
  • Suitable for use on floors with radiant heating
  • Compatible with SikaBond® wood flooring adhesives and Sika® Levels.