Sika® AcouBond® System

• LEED® EQc 4.1 (100 g/L limit) - Passes
• SCAQMD, Rule 1168 (100 g/L limit) - Passes
• BAAQMD, Reg. 8, Rule 51 (120 g/L limit) - Passes

Sika® AcouBond®-System with SikaLayer®-03:

• Independently tested to - IIC 59 (ASTM E 492) and STC 60 (ASTM E 90)(6 “ concrete slab, 5/8 “ suspended gypsum ceiling)
• Independently field tested to - FIIC 59 (ASTM E 1007) and FSTC 59 (ASTM E 336)(8 “ concrete slab, no suspended ceilings)
• Reduction of Impact Sound Δ IIC = 24 (ASTM E 2179)

Temperatures between +50°F and +77°F (+10°C and +25°C). Store cool and dry. Protect against direct sunlight and frost.

Clean and dry, homogeneous, even, free from grease, dust and loose particles. Paint, laitance and other poorly adhering particles must be removed by mechanical means.

 
Substrate Temperature
During laying and until SikaBond®-T53 has fully cured substrate temperature should be greater than 60°F (15°C) and in case of floor heating, less than 70°F (20°C).

 
Air Temperature
Room temperature between 60°F (15°C) and 90°F (35°C). For ambient temperatures the standard construction rules are relevant. Follow all wood floor manufacturer’s acclimation and room temperature requirements.

 
Substrate Humidity
Moisture requirements are set forth to protect the wood flooring products that can expand and contract with different moisture levels. The Sika® Acoubond® System is not affected by moisture or vapor transmission. The guidelines below are included to provide the best practices in moisture vapor testing that exists today. Permissible substrate moisture contents are listed on the chart below. For more information on the use of the CM method please contact Troy Corporation at 973-443-4200.
 

The National Wood Flooring Association recommends the use of moisture testing devices that identify actual moisture content in percentages (%). For best results in measuring the moisture levels in cement based subfloor use the Tramex measuring device to find the highest reading in the application area and then run the CM method at that highest point to determine the worst case. As a general guideline for floors with no in-floor heating if the Tramex is below 4 % the Sika® MB will not be necessary and between 4 % and 6 % Sika® MB will be required - however, the CM method must be used to make final determination of concrete moisture levels – use chart above. For moisture content and quality of
substrates the guidelines of wood floor manufacturer must be observed.

The Sika® AcouBond® System can generally be used without priming on properly prepared, structurally sound concrete, cement floors, chipboards, ceramic tiles, plywood, and hardwood. Sika recommends the use of Sika® MB over any dry, gypsum-based subflooring to
enhance surface strength. The maximum acceptable floor variation is 3/16 in.(4.7 mm) in 10 ft (3 m). Preparation is a critical step in the installation process and will ensure a successful long-term tenacious bond. All concrete, cement screed, and gypsum-based subfloors must be structurally sound, clean, dry, smooth, free of voids, projections, loose materials, oil, grease, sealers and other surface contaminants. Remove
laitance or weak areas mechanically. For application over ceramic tiles, it is necessary to grind tile surfaces and clean thoroughly with an industrial vacuum. For substrates with old well-bonded adhesive or adhesive residue use Sika® MB – see Sika® MB data sheet for installation instructions and proper details. If the surface contains asphalt (cutback) adhesive follow the Resilient Floor Covering Institute “Recommended Work Practices” for removal. When the asphalt (cutback) adhesive is sufficiently removed use Sika® MB to help promote adhesion to the subfloor – or use an industry-approved leveling compound over the cutback residue. The Sika® AcouBond® System will adhere to most common patching/ leveling compounds. Due to differences in asphalt-based adhesive types and performance capabilities applicator must verify that preparation of the surface is sufficient prior to using Sika® MB or patch/ level compound. For unknown substrates please contact Sika® Technical Services for best practices at 1-800-933-SIKA.

Roll out SikaLayer®-03 mat on the properly prepared substrate, Tools parallel to the laying direction of the wood floor. The mat does not get glued to the subfloor – unless adhesive is used to keep the mat from sliding. The foam mat should be placed approximately 3⁄4” away from walls and approximately 3⁄4” away to any adjacent mat. This will allow for the placement of both a perimeter adhesive bead and an adhesive bead between any two adjacent mats. To apply the adhesive a sausage gun is required.

Apply the adhesive with manual or air-pressure-gun into all cut-outs with the supplied triangular nozzle. Also, apply adhesive beads at room perimeters and between adjacent mats as mentioned above. Take care to place only enough adhesive to allow sufficient time to place wood into adhesive while the adhesive is still very wet. Filling all cut-outs is a must. The nozzle must be held vertical to the substrate - 90-degree angle. Take care not to apply adhesive on top of the mat.

Position wood boards and firmly press into the adhesive until they lay tight on the SikaLayer® mat. The wood boards can then be joined together using a rubber mallet or hammer and an impact block. Follow the required distance from the wall to the wood floor in the laying instruction from the wood floor manufacturer. Spacers should be used to ensure perimeter space is maintained. When working at or near room perimeters, doorways or tight areas additional slots may be needed in the SikaLayer®-03 mat to accommodate short edge pieces and to ensure enough adhesive to securely hold the wood down. Use a razor knife to make cutouts in mat the same size as existing pre-cut openings.

Fresh, uncured adhesive remaining on the wood floor surface must be removed immediately with SikaBond® Remover. Failure to do so could result in a dulled finish. The laying instructions of the wood floor manufacturer as well as standard construction rules must be observed throughout the installation process.

All tools must be cleaned immediately after use with SikaBond® Remover or standard industry cleaning solvent. Any adhesive that is permitted to cure on the tool will need to be removed by mechanical means. SikaBond® Remover can be used to remove uncured or cured adhesive and fingerprints from the wood surface.