SikaBond®-T55

1-component Polyurethane, moisture curing

12 months from date of production if stored in undamaged, unopened, original sealed containers.

Store in dry conditions and protected from direct sunlight at temperatures between 50 °F and 77 °F (10 °C and 25 °C).

-40 °F (-40 °C) to 158 °F (70 °C)

Consistency: Spreads very easily, holds ridges after troweling.

Room temperature between 60 °F (15 °C) and 90 °F (35 °C). For ambient temperatures the standard construction rules are relevant. Follow all wood floor manufacturer’s acclimation and room temperature requirements.

Between 40 % and 70 %

During laying and until SikaBond®-T55 has fully cured, substrate temperature should be greater than 60 °F (15 °C) and in case of floor heating, less than 70 °F (20 °C). For substrate temperatures, the standard construction rules are relevant

Moisture requirements are set forth to protect the wood flooring products that can expand and contract with different moisture levels. SikaBond®-T55 is not affected by moisture or vapor transmission. The guidelines below are included to provide the best practices in moisture vapor testing that exists today. Permissible substrate moisture contents are listed on the chart below. For more information on the use of the CM method please contact Troy Corporation at 973-443-4200.

The National Wood Flooring Association recommends the use of moisture testing devices that identify actual moisture content in percentages (%). For best results in measuring the moisture levels in cement based subfloor use the Tramex measuring device to find the highest reading in the application area and then run the CM method at that highest point to determine the worst case. As a general guideline for floors with no in-floor heating if the Tramex is below 4 % the Sika® MB will not be necessary and between 4 % and 6 % Sika® MB will be required - however, the CM method must be used to make final determination of concrete moisture levels – use chart above. For moisture content and quality of substrates the guidelines of wood floor manufacturer must be observed.

4.0 mm/24h at 73 °F(23 °C) and 50 % RH.

Floor may accept light foot traffic after 4 hrs. and sanded 12 hrs. after installation (depending on climatic conditions and adhesive layer thickness).

~ 45–60 minutes at 73 °F(23 °C) and 50 % RH

• Coverage must be monitored to ensure accuracy of application. Trowel angle may prevent proper coverage.
• Applicator is responsible for periodic inspection of the trowel to check for excessive wear. Worn trowels must be replaced immediately.
• In case of uneven substrates, it may be necessary to use a notched trowel with bigger notches (avert hollow sections).
• Coverage must be monitored to ensure accuracy of application. Trowel angle may prevent proper coverage.
• Trowel size is recommended to obtain proper coverage larger sizes are acceptable. Excessive amounts of adhesive may cause wood flooring to slide while placing check coverage during installation.
• P5 trowels should be used at 90° angle
• Substrate Quality: Structurally sound, clean, dry, homogeneous, even, free from grease, dust and loose particles, paint, laitance, and other poorly adhering particles must be removed.
• The P5 trowel available from Sika.

Substrate must be clean and dry, homogeneous, even, free from grease, dust and loose particles. Paint, laitance and other poorly adhering particles must be removed by mechanical means.

• SikaBond®-T55 can be used on properly prepared, structurally sound concrete, cementitious patch/underlayments, chipboards, ceramic tiles, plywood.
• Concrete substrate must have a concrete surface profile of CSP 1-3.
• For on-grade subfloors Sika® recommends the use of Sika® MB, Sika® MB Redline, and Sika® MB EZ Rapid for best protection against sub-floor moisture – moisture testing is required by the wood flooring manufacturer for best results with the wood flooring products.
• Below grade applications are generally not recommended unless proper precautions are taken to protect the wood flooring from sub-floor and in-room humidity extremes.
• A 3,000 psi compressive strength is the minimum requirement needed for SikaBond wood floor installations, including glue-down wood floors, or glued/mechanically anchored subfloors. Sika products such as SikaLevel®-01 Primer Plus, Sika® MB, Sika® MB Redline, and Sika® MB EZ Rapid can be used on substrates as consolidators to satisfy the minimum psi compressive strength requirements.
• Preparation is a critical step in the installation process and will ensure a successful long term tenacious bond.
• All concrete, cement screed and gypsum based subfloors must be structurally sound, clean, dry, smooth; free of voids, projections, loose materials, oil, grease, sealers and other surface contaminants. Thoroughly clean with an industrial vacuum. Remove laitance or weak areas mechanically and thoroughly.
• For application over ceramic tiles it is necessary to grind tile surfaces and clean thoroughly with an industrial vacuum.
• For substrates with old well bonded non-water-soluble adhesive or adhesive residue use Sika® MB, Sika® MB Redline, or Sika® MB EZ Rapid – see appropriate product data sheet for installation instructions and proper details. If surface contains asphalt (cutback) adhesive, follow the Resilient Floor Covering Institute “Recommended Work Practices” for removal. When the asphalt (cutback) adhesive is sufficiently removed use the Sika® MB, Sika® MB Redline, or Sika® MB EZ Rapid to help promote adhesion to the subfloor or use a Sika® Level patch/level product in conjunction with the correct primer.
• SikaBond®-T55 will adhere to most common patching/ levelling compounds. Due to differences in asphalt-based adhesive types and performance capabilities, applicators must verify that preparation of the surface is sufficient prior to using Sika® MB or Sika® Level patch/ level compound. For unknown substrates, please contact Sika® Technical Services for best practices at 1-800-933-SIKA.

All tools must be cleaned immediately after use with SikaBond® Remover or standard industry cleaning solvent. Any adhesive that is permitted to cure on the tool will need to be removed by mechanical means. SikaBond Remover can be used to remove uncured or cured adhesive and fingerprints from wood surface.