SikaBond®-T17

1-component, moisture cured polyurethane

12 months from date of production if stored in undamaged original sealed containers per storage requirements

In dry conditions and protected from direct sunlight at temperatures between 50°F and 77°F (10°C and 25°C).

Condition material to 65–75°F (18–24°C) before using.

-40°F (-40°C) to 158°F (70°C)

Consistency: spreads easily, holds ridges after troweling

Room temperature between 60°F (15°C) and 90°F (32°C). For ambient temperatures the standard construction rules are relevant. Follow all wood floor manufacturer’s acclimation and room temperature requirements.

Between 40% and 70% during installation is best for adhesive. See wood floor manufacturer for wood requirements.

During laying and until SikaBond®-T17 has fully cured, substrate temperature should be greater than 60°F (15°C) and in case of radiant heating, less than 68°F (20°C). For substrate temperatures, the standard construction rules are relevant.

For use as an adhesive only: SikaBond®-T17 is not affected by moisture or vapor transmission. For protection of the wood, follow the wood floor manufacturer’s requirements for subfloor moisture. If substrate is not acceptable, use SikaBond®-T17 at recommended coverage rate as Moisture Control or Sika® MB. See Technical Data Sheet for proper instruction.

For use as an adhesive and moisture membrane: Concrete moisture vapor emission rate (MVER) may not exceed 8 lbs. per 1,000 sq.ft. (3.63 kg per 92.9 m²) per 24 hours, anhydrous calcium chloride test (ASTM F1869). Do not install when the relative humidity (RH) of the concrete slab exceeds 85% (ASTM F2170).

Floor may accept light foot traffic after:

• at 45–50 SF/gal (P5 trowel): after 6–8 hr
• at 30–35 SF/gal (SC+MB trowel): after ~12 hr

(depending on climatic conditions and adhesive layer thickness)

Floor can be sanded after ~18 hours

45–60 minutes at 73°F (23°C) and 50% RH

• Coverage must be monitored to ensure accuracy of application. Trowel angle may prevent proper coverage.
• Applicator is responsible for periodic inspection of the trowel to check for excessive wear. Worn trowels must be replaced immediately.
• In case of uneven substrates, it may be necessary to use a notched trowel with bigger notches (avert hollow sections).
• Trowel size is recommended to obtain proper coverage larger sizes are acceptable. Excessive amounts of adhesive may cause wood flooring to slide while placing check coverage during installation.
• P5 trowels should be used at 90° angle, SC+MB trowel or 1/4 in. (6.3 mm) x 1/4 in. (6.3 mm) V-notch at 45° angle to subfloor to get stated coverages.
• Substrate quality: Structurally sound, clean, dry, homogeneous, even, free from grease, dust and loose particles, paint, laitance, and other poorly adhering particles must be removed.
• The P5 and SC+MB trowel are available from Sika.

Substrate must be clean and dry, homogeneous, even, free from grease, dust and loose particles. Paint, laitance and other poorly adhering particles must be removed by mechanical means.

• SikaBond®-T17 can be used on properly prepared, structurally sound concrete, cementitious patch/underlayments, chipboards, ceramic tiles, plywood.
• Concrete substrate must have a concrete surface profile of CSP 1-3.
• For on-grade subfloors Sika recommends the use of Sika® MB, Sika® MB Redline, and Sika® MB EZ Rapid for best protection against sub-floor moisture – moisture testing is required by the wood flooring manufacturer for best results with the wood flooring products.
• Below grade applications are generally not recommended unless proper precautions are taken to protect the wood flooring from sub-floor and in-room humidity extremes.
• A 3,000 psi compressive strength is the minimum requirement needed for SikaBond® wood floor installations, including glue-down wood floors, or glued/mechanically anchored subfloors. Sika products such as Sika® Level-01 Primer Plus, Sika® MB, Sika® MB Redline, and Sika® MB EZ Rapid can be used on substrates as consolidators to satisfy the minimum psi compressive strength requirements.
• Preparation is a critical step in the installation process and will ensure a successful long term tenacious bond.
• All concrete, cement screed and gypsum based subfloors must be structurally sound, clean, dry, smooth; free of voids, projections, loose materials, oil, grease, sealers and other surface contaminants. Thoroughly clean with an industrial vacuum. Remove laitance or weak areas mechanically and thoroughly.
• For application over ceramic tiles it is necessary to grind tile surfaces and clean thoroughly with an industrial vacuum.
• For substrates with old well bonded non-water soluble adhesive or adhesive residue use Sika® MB, Sika® MB Redline, or Sika® MB EZ Rapid – see appropriate product data sheet for installation instructions and proper details. If surface contains asphalt (cutback) adhesive, follow the Resilient Floor Covering Institute “Recommended Work Practices” for removal. When the asphalt (cutback) adhesive is sufficiently removed use the Sika® MB, Sika® MB Redline, or Sika® MB EZ Rapid to help promote adhesion to the subfloor or use a Sika® Level patch/level product in conjunction with the correct primer.
• SikaBond®-T17 will adhere to most common patching / levelling compounds. Due to differences in asphalt-based adhesive types and performance capabilities, applicators must verify that preparation of the surface is sufficient prior to using Sika® MB or Sika® Level patch / level compound. For unknown substrates, please contact Sika® Technical Services for best practices at 1-800-933-SIKA.

All tools must be cleaned immediately after use with SikaBond® Remover or standard industry cleaning solvent. Any adhesive that is permitted to cure on the tool will need to be removed by mechanical means. SikaBond® Remover can be used to remove uncured or cured adhesive and fingerprints from wood surface.