Sikafloor® PurCem® TG
TROWEL GRADE POLYURETHANE CEMENTITIOUS MORTAR ENGINEERED WITH SIKAFLOOR-19 NA PURCEM @ 1/4'' - 3/8'' (250 - 375 MILS)
Sikafloor® PurCem® TG is a phthalate-free, water dispersed polyurethane mortar system to provide excellent, resistance to abrasion, impact, chemical attack and thermal shock. Aggregate may be broadcast onto the wet screed to increase surface texture and provide slip resistance. Sikafloor® PurCem® TG typically installed @1/4'' - 3/8'' (250 - 375 mils).
- Can be applied on green concrete, typically 7-10 days. Full 28 days cure time is not necessary.
- Can be applied over partially cured concrete substrates (> 4% mass (pbw –part by weight) as measured with Tramex® CME/CMExpert type concrete moisture meter surface moisture).
- Can be applied to concrete substrates where <100 % relative humidity is measured as per ASTM F2170.
- Substrate has tensile bond strength in excess of 218 psi (1.5 MPa). Substrate has tensile bond strength in excess of 218 psi (1.5 MPa).
- Resists a very wide range of organic and inorganic acids, alkalis, amines, salts and solvents. Consult Sika Technical Service for full details. Refer to the Sikafloor -19 NA Purcem (FS) Chemical Resistance Chart.
- Similar coefficient of thermal expansion to concrete allowing movement with the substrate through normal thermal cycling. It will perform and retain its physical characteristics through a wide temperature range from -40 °F (-40 °C) up to 248 °F (120 °C).
- Steam cleanable at 1/4" to 3/8' (250 to 375 mils) thickness.
- Non-tainting, odorless.
- Behaves plastically under impact / deforms but will not crack or debond.
- High abrasion qualities result from its aggregate structure.
- Extra Expansion joints are not necessary; maintain and extend existing expansion joints up through the Sikafloor PurCem Flooring System.
- Minimal maintenance costs, superior life cycle cost advantage versus tile.
- Meets the requirements of USDA for use in food plants.
System Structure
Usage
- Sikafloor® PurCem® TG is primarily used to protect concrete substrates
- Typically used in food processing plants, wet and dry process areas, freezers and coolers, thermal shock areas, dairies, breweries, wineries, distilleries, laboratories, chemical process plants, pulp and paper plants, warehouses and storage areas
Advantages
- Can be applied on green concrete, typically 7-10 days. Full 28 days cure time is not necessary.
- Can be applied over partially cured concrete substrates (> 4% mass (pbw –part by weight) as measured with Tramex® CME/CMExpert type concrete moisture meter surface moisture).
- Can be applied to concrete substrates where <100 % relative humidity is measured as per ASTM F2170.
- Substrate has tensile bond strength in excess of 218 psi (1.5 MPa). Substrate has tensile bond strength in excess of 218 psi (1.5 MPa).
- Resists a very wide range of organic and inorganic acids, alkalis, amines, salts and solvents. Consult Sika Technical Service for full details. Refer to the Sikafloor -19 NA Purcem (FS) Chemical Resistance Chart.
- Similar coefficient of thermal expansion to concrete allowing movement with the substrate through normal thermal cycling. It will perform and retain its physical characteristics through a wide temperature range from -40 °F (-40 °C) up to 248 °F (120 °C).
- Steam cleanable at 1/4" to 3/8' (250 to 375 mils) thickness.
- Non-tainting, odorless.
- Behaves plastically under impact / deforms but will not crack or debond.
- High abrasion qualities result from its aggregate structure.
- Extra Expansion joints are not necessary; maintain and extend existing expansion joints up through the Sikafloor PurCem Flooring System.
- Minimal maintenance costs, superior life cycle cost advantage versus tile.
- Meets the requirements of USDA for use in food plants.
Packaging
Please refer to the individual Product Data Sheet
Color
Available in standard PurCem colors.
System Details
System Structure
Sikafloor® PurCem® TG System 1/4" - 3/8" (250 - 375 Mils)
|
|
| Description | Products | Thickness mils | ||||
| Trowled Mortar | Sikafloor®-19 NA PurCem* | 250 -375 | ||||
|
Options | ||||||
| Primer/ Scratch Coat | Sikafloor®-2570 Sikafloor®-31 NA PurCem* Sikafloor®-24 NA PurCem* | 3 -5 15 -20 40 -45 | ||||
| Broadcast (increased slip resistance) | Sikadur®- 508 Aggregate | 0.25 lb/sq.ft | ||||
| Top Coat | Sikafloor®-31 NA PurCem* | 15 -20 |
* To reduce cure time use Sikafloor®- PurCem® Fast Set
Nominal thickness
1/4" to 3/8" (250 to 375 mils)
Minimum thickness
1/4" (250 mils)
Volatile organic compound (VOC) content
Please refer to the individual Product Data Sheet
Shelf Life
Please refer to the individual Product Data Sheet
Storage Conditions
Please refer to the individual Product Data Sheet
Shore D Hardness
| 82 | ASTM D2240 at 73° F (23° C) and 50% RH |
Abrasion Resistance
| CS-17/1,000 cycles/1,000 g -0.155 g loss | ASTM D4060 at 73° F (23° C) and 50% R.H |
Indentation
| ~ 0% | MIL-PRF -24613 at 73° F (23° C) and 50% R.H |
Compressive Strength
| 6,050 psi (41.7 MPa) 28 days | ASTM 579 at 73° F (23° C) and 50% RH |
Tensile Strength
| 540 psi ( 3.7 MPa)
| ASTM C307 at 73° F (23° C) and 50% RH |
Flexural Strength
| 1,572 psi (10.8 MPa) |
| 6.29 x 105 psi (4.34 x 103 MPa) Flexural Modulus |
Tensile Adhesion Strength
| > 400 psi (> 2.5 MPa) (substrate failure) | ASTM D4541 at 73° F (23° C) and 50% RH |
Microbiological Resistance
| Resistance to Fungi Growth Rated 0 (no growth) | ASTM G21 at 73° F (23° C) and 50% R.H |
| Resistance to Mold Growth Rated 10 (highest resistance) | ASTM D3273 at 73° F (23° C) and 50% R.H |
Thermal Conductivity
| Pass | ASTM C884 at 73° F (23° C) and 50% RH |
Application
Ambient Air Temperature
Minimum/Maximum 40˚/85˚F (4˚/30˚C)
Substrate Temperature
Minimum/Maximum 40˚/85˚F (4˚/30˚C).
Pot Life
Please refer to the individual Product Data Sheet
Waiting / Recoat Times
Please refer to the individual Product Data Sheet
Coverage
| Description | Products | Approximate Sq.Ft/kit | ||||
| Trowled Mortar | Sikafloor®-19 NA PurCem* | 34@1/4" | ||||
|
Options | ||||||
| Primer/ Scratch Coat | Sikafloor®-2570 Sikafloor®-31 NA PurCem* Sikafloor®-24 NA PurCem* | 2667@3 mils 224@15 mils 71@120 mils | ||||
| Broadcast (Increased slip resistance) | Sikadur®- 508 Aggregate | 0.25 lb/sq.ft | ||||
| Top Coat | Sikafloor®-31 NA PurCem* | 224@5 mils |
*Sikafloor®- PurCem Fast Set Sq.Ft coverage per kit is equivalent to
standard Sikafloor®- PurCem.
SUBSTRATE PREPARATION
Surface should be clean and sound. Remove all dust, dirt, existing paint films, efflorescence, exudates, laitance, forms oils, hydraulic or fuel oils, brake fluid, grease, fungus, mildew, biological residues or any other contaminants which may prohibit good bond. Prepare the surface by any appropriate mechanical means, in order to achieve a profile equivalent to ICRI-CSP 3-6. The compressive strength of the concrete substrate should be at least 3,625 psi (25 MPa) and a minimum of 218 psi (1.5 MPa) in tension at the time of application.
Repairs to cementitious substrates, filling of blowholes,leveling of irregularities, etc. should be carried out using an appropriate Sika profiling mortar. Contact Sika Technical Service for a recommendation.
Edge Terminations
All free edges of a Sikafloor PurCem floor, whether at the perimeter, along gutters or at drains require extra anchorage to distribute mechanical and thermal stresses. This is best achieved by forming or cutting grooves in the concrete. Grooves should have a depth and width of 2 times the thickness of the Sikafloor PurCem floor. Contact Sikafloor Technical Service for more information and construction details.
If necessary, protect all free edges with mechanically attached metal strips. Do not featheredge, always turn into an anchor groove.
Expansion Joints
Expansion joints should be provided in the substrates at the intersection of dissimilar materials. Isolate areas subject to thermal stresses, vibration movements or around load-bearing columns and at vessel sealing rings. Refer to details provided at https://usa.sika.com/flooring.
Priming
Please refer to the individual Product Data Sheet for each component.
MIXING
Please refer to the individual Product Data Sheet for each component.
APPLICATION
Please refer to the individual Product Data Sheet for each component.